Students will learn about the different types of manufacturing, specifically the 3D printing process, and the implications it has in today’s society. After an introduction to Tinkercad, the design software the students will be using, they will have the design challenge of creating a puzzle with various-sized pieces that must fit into one another. This task will emphasize the importance of precise measurements. They will then have the opportunity to create their own design of their choosing.
Students will:
- Learn about designing and constructing products
- Describe and explain the different types of manufacturing
- Identify the various fields that utilize 3D printing
- Use TinkerCad software to design their various products
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Lab time commitment
70-90 minutes (including 25-minute intro video)
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Lab materials
Digital materials only
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Live Q&A session and wrap up with
College Students & Professional Engineers
October 30, 2024
Milton Davis
Curriculum Coordinator, Engineering Tomorrow
Aerospace Engineer, NASA
Classroom Tools & Resources
Get access to all of the presentation materials, workbooks and resources to run the Product Engineering lab in your classroom.
Lab Intro Videos
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Teacher Guide
Pre-work, instructions and troubleshooting advice.
ViewStudent Workbook
Questions and assessments from the lab presentation.
ViewAbbreviated Student Worksheet
A worksheet containing major student lab activities.
ViewEngineer’s Presentation
Full lab presentation presented by our engineers.
ViewMeet the lab intro host
Olivia Jaenicke
Optical Production Engineer
,
ASML
Olivia has worked in the semiconductor industry since 2020, after she completed her B.S. in Mechanical Engineering with a concentration in Irish Literature from the University of Notre Dame. She has since worked as an Optical Production Engineer at ASML in Wilton, CT.
She recently returned from a 1-year contract in Oberkochen, Germany where she was a process development engineer for EUV lithography optics at Zeiss Semiconductor. She also earned her M.S. in Electrical Engineering from Purdue University. In her free time she enjoys learning the German language and training for half marathons.
Olivia has worked in the semiconductor industry since 2020, after she completed her B.S. in Mechanical Engineering with a concentration in Irish Literature from the University of Notre Dame. She has since worked as an Optical Production Engineer at ASML in Wilton, CT.
She recently returned from a 1-year contract in Oberkochen, Germany where she was a process development engineer for EUV lithography optics at Zeiss Semiconductor. She also earned her M.S. in Electrical Engineering from Purdue University. In her free time she enjoys learning the German language and training for half marathons.